학술발표 (Conference) |
129 items, 5 / 9pages
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01. Development of Center-Bored Outer-Surface Sealed Timber Drying Method and Evaluation of the Drying Energy Consumption [Poster]
박준호
IUFRO World Congress 2014
Salt Lake City, USA
October 05, 2014 ~ October 11, 2014
IUFRO.pdf (623.03KiB, 33Hits)
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02. Assessment for Half-Life and Carbon Stock of Harvested Wood Products in Korea [Poster]
장윤성
IUFRO World Congress 2014
Salt Lake City, USA
October 05, 2014 ~ October 11, 2014
IUFRO.pdf (623.03KiB, 27Hits)
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03. New Biocomposites for Bioscrew in Bone Joint Desease [Oral]
이태형, 김현중
International Workshop on Basis and Application of Woody Materials & Natural Fiber Composites
Yamaguchi University, Japan
September 12, 2014 ~ November 30, -0001
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04. Effect of Salt Condition on Polyelectrolytes Multilayering on Ground Calcium Carbonate for High Filler Loading in Paper [Poster]
이제곤
Progress in Paper Physics 2014 Seminar
Raleigh, NC, USA
September 08, 2014 ~ September 11, 2014
paper physics.pdf (799.42KiB, 36Hits)
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05. Discoloration of Nanofibrillated Cellulose Depending on Drying Condition [Poster]
이제곤
Progress in Paper Physics 2014 Seminar
Raleigh, NC, USA
September 08, 2014 ~ September 11, 2014
paper physics.pdf (799.42KiB, 29Hits)
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06. The Role of The Adhesive to Overcome The Bottleneck in The Electrical and Electronic Convergence Industry [Oral]
김현중
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 39Hits)
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07. Fabrication of Hybrid Optically Clear Adhesives with UV Cationic Curing for Improving Properties and Black Matrix Curing [Oral]
유영민, 박지원, 임동혁, 김현중, 신승한
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 28Hits)
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08. Study on Adhesion Properties of Hot-Melt Pressure Adhesive Based on Epoxidized Styrene-Isoprene-Styrene(ESIS) Copolymer for Transdermal Drug Delivery Systems(TDDS) [Oral]
Peng Dou, Jue Cheng, Junying Zhang, Hyun-Jonng Kim
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 47Hits)
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09. Evaluation of Shrinkage at UV Curing Process by Comparing between Numerical Approach and Experimental Methods [Oral]
박지원, 이종규, 유영민, 김현중, 신승한
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 29Hits)
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10. Analysis of The Curing Behavior and Adhesion Properties of Thermal/UV Dual-Curing System for Optically Clear Adhesives [Oral]
이태형, 박지원, 임동혁, Dou peng, 김현중, 신승한
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 26Hits)
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11. Research on Conductivity Change of Electrical Conductive Adhesives Depends on Shrinkage [Oral]
이종규, 박지원, Peng Dou, 김현중, 신승한
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 26Hits)
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12. Thermal Properties of Acrylic Pressure Sensitive Adhesives with Micro-Encapsulated Phase Change Material(PCM) and Single Wall Carbon Nanotubes(SWCNT) [Oral]
이성주, 박지원, 이승우, 김현중, 신승한
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 23Hits)
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13. Synthesis and Adhesion Performance of Acrylic Polymer/Organoclay Nanocomposite PSAs by In-Situ Photoinitiated Polymerization [Oral]
김 훈, 박지원, 박초희, 김현중, 신승한
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
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14. Preparation of Cloud Point Resistant-Adhesive and Its Performance for Touch Screen Panel [Oral]
박초희, 김현중
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
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15. Design and Characterization of Temporary Bonding and Debonding Adhesives for 3D Multichip Packaging Process [Oral]
이승우, 이태형, 박지원, 박초희
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
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