연구성과
1차년도
(2013.3 ~ 2014.2)
2차년도
(2014.3 ~ 2015.2)
3차년도
(2015.3 ~ 2016.2)
4차년도
(2016.3 ~ 2017.2)
5차년도
(2017.3 ~ 2018.2)
6차년도
(2018.3 ~ 2019.2)
7차년도
(2019.3 ~ 2020.2)
학술발표 (Conference)
43 items, 2 / 3pages
01. Evaluation of UV-Curing Kinetics of the UV Polymerized Adhesives with Poly(ethylene glycol) Dimethacrylate [Poster]
박지원
2015 Award for Excellence in Adhesion Society Symposium
Savannah, Georgia, USA
February 20, 2015 ~ February 25, 2015
2015_AS_미국접착학회.pdf (277.06KiB, 46Hits)
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02. Synthesis and Evaluation of Hybrid Curing OCA Using UV Polymerization [Oral]
김현중
2015 Award for Excellence in Adhesion Society Symposium
Savannah, Georgia, USA
February 20, 2015 ~ February 25, 2015
2015_AS_미국접착학회.pdf (277.06KiB, 47Hits)
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03. Hybrid Curable OCA for New Assembly Line of Touch Screen Panel [Poster]
김현중
2015 Award for Excellence in Adhesion Society Symposium
Savannah, Georgia, USA
February 20, 2015 ~ February 25, 2015
2015_AS_미국접착학회.pdf (277.06KiB, 56Hits)
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04. The Role of the Adhesive to Overcome the Bottleneck in the Electrical and Electronic Convergence Industry [Oral]
김현중
Material & Mathematics
Guangdong Hotel, Shanghai, China
January 29, 2015 ~ January 31, 2015
상하이_초청강연..pdf (2.38MiB, 38Hits)
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05. EVA/Intumescent Agent Flame Retardant Composite Materials using Organic/Inorganic Hybrid Filler [Oral]
박지원
International Conference on Construction Materials and Structures (ICCMATS 2014)
University of Johannesburg, South Africa
November 24, 2014 ~ November 26, 2014
표지이미지 없음
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06. Polymer Testing of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process [Poster]
이승우, 이태형, 박지원, 박초희, 김현중, 이성훈, 김승만, 이재학, 송준엽
Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference
University of Tokyo, Japan
October 22, 2014 ~ October 24, 2014
ADMETA_PLUS_2014.pdf (494.53KiB, 28Hits)
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07. Polymer Synthesis and Properties of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process [Poster]
이승우, 이태형, 박지원, 박초희, 김현중, 이성훈, 김승만, 이재학, 송준엽
Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference
University of Tokyo, Japan
October 22, 2014 ~ October 24, 2014
ADMETA_PLUS_2014.pdf (494.53KiB, 23Hits)
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08. Design and Characterizations of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process [Poster]
이승우, 이태형, 박지원, 박초희, 김현중, 이성훈, 김승만, 이재학, 송준엽
Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference
University of Tokyo, Japan
October 22, 2014 ~ October 24, 2014
ADMETA_PLUS_2014.pdf (494.53KiB, 30Hits)
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09. Laser Assisted EZR Debonding Technology for 3D-TSV Packaging Process [Oral]
이승우, 이태형, 박지원, 박초희, 김현중, 이성훈, 김승만, 이재학, 송준엽
Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference
University of Tokyo, Japan
October 22, 2014 ~ October 24, 2014
ADMETA_PLUS_2014.pdf (494.53KiB, 24Hits)
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10. New Biocomposites for Bioscrew in Bone Joint Desease [Oral]
이태형, 김현중
International Workshop on Basis and Application of Woody Materials & Natural Fiber Composites
Yamaguchi University, Japan
September 12, 2014 ~ November 30, -0001
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11. Research on Conductivity Change of Electrical Conductive Adhesives Depends on Shrinkage [Oral]
이종규, 박지원, Peng Dou, 김현중, 신승한
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 22Hits)
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12. Fabrication of Hybrid Optically Clear Adhesives with UV Cationic Curing for Improving Properties and Black Matrix Curing [Oral]
유영민, 박지원, 임동혁, 김현중, 신승한
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 26Hits)
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13. Study on Adhesion Properties of Hot-Melt Pressure Adhesive Based on Epoxidized Styrene-Isoprene-Styrene(ESIS) Copolymer for Transdermal Drug Delivery Systems(TDDS) [Oral]
Peng Dou, Jue Cheng, Junying Zhang, Hyun-Jonng Kim
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 42Hits)
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14. Evaluation of Shrinkage at UV Curing Process by Comparing between Numerical Approach and Experimental Methods [Oral]
박지원, 이종규, 유영민, 김현중, 신승한
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 25Hits)
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15. Analysis of The Curing Behavior and Adhesion Properties of Thermal/UV Dual-Curing System for Optically Clear Adhesives [Oral]
이태형, 박지원, 임동혁, Dou peng, 김현중, 신승한
5th World Congress on Adhesion and Related Phenomena
Nara Prefectural New Public Hall, Nara, Japan
September 07, 2014 ~ September 11, 2014
WCARP-V.pdf (4.51MiB, 25Hits)
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