연구성과
1차년도
(2013.3 ~ 2014.2)
2차년도
(2014.3 ~ 2015.2)
3차년도
(2015.3 ~ 2016.2)
4차년도
(2016.3 ~ 2017.2)
5차년도
(2017.3 ~ 2018.2)
6차년도
(2018.3 ~ 2019.2)
7차년도
(2019.3 ~ 2020.2)
학술발표 (Conference)
129 items, 4 / 9pages
01. Moisture Content Prediction Model Development using Complex Dielectric Permittivity of Wood in Radio Frequency [Poster]
양상윤, 박용건, 정현우
International Symposium on Wood Science and Technology 2015 (IAWPS 2015)
Tower Hall Funabori, Tokyo, Japan
March 15, 2015 ~ March 17, 2015
학술해외-물리-150315.pdf (1.97MiB, 78Hits)
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02. The Process of Superheated Steam Heat Treatment and Properties of Treated Wood [Oral]
박용건, 양상윤, 정현우
International Symposium on Wood Science and Technology 2015 (IAWPS 2015)
Tower Hall Funabori, Tokyo, Japan
March 15, 2015 ~ March 17, 2015
학술해외-물리-150315.pdf (1.97MiB, 31Hits)
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03. Hybrid Curable OCA for New Assembly Line of Touch Screen Panel [Poster]
김현중
2015 Award for Excellence in Adhesion Society Symposium
Savannah, Georgia, USA
February 20, 2015 ~ February 25, 2015
2015_AS_미국접착학회.pdf (277.06KiB, 44Hits)
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04. Synthesis and Evaluation of Hybrid Curing OCA Using UV Polymerization [Oral]
김현중
2015 Award for Excellence in Adhesion Society Symposium
Savannah, Georgia, USA
February 20, 2015 ~ February 25, 2015
2015_AS_미국접착학회.pdf (277.06KiB, 32Hits)
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05. Evaluation of UV-Curing Kinetics of the UV Polymerized Adhesives with Poly(ethylene glycol) Dimethacrylate [Poster]
박지원
2015 Award for Excellence in Adhesion Society Symposium
Savannah, Georgia, USA
February 20, 2015 ~ February 25, 2015
2015_AS_미국접착학회.pdf (277.06KiB, 33Hits)
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06. Understanding and Evaluation on the Linear Shrinkage of Photo-Curing Behavior through the Experimental Approach and Numerical Modeling [Oral]
박지원
2015 Award for Excellence in Adhesion Society Symposium
Savannah, Georgia, USA
February 20, 2015 ~ February 25, 2015
2015_AS_미국접착학회.pdf (277.06KiB, 26Hits)
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07. The Role of the Adhesive to Overcome the Bottleneck in the Electrical and Electronic Convergence Industry [Oral]
김현중
Material & Mathematics
Guangdong Hotel, Shanghai, China
January 29, 2015 ~ January 31, 2015
상하이_초청강연..pdf (2.38MiB, 24Hits)
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08. Effect of Zeolite on Levulinic Acid Yield from Dilute Acid-Pretreated Mongolian Oak [Poster]
정한섭
Pacific Rim Summit on Industrial Biotechnology and Bioenergy
San Diego, California, USA
December 07, 2014 ~ December 09, 2014
pacific_rim_-정한섭,장수경(화학실).pdf (1.09MiB, 27Hits)
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09. Evaluation of Conversion Rate to Sugars and Sugar Derivatives from Bark-Containing Larix Kaempferi after Two-Step Dilute Acid Pretreatment depending on various Pretreatment Conditions [Poster]
장수경, 박준호, 손휘림, 박주생, 박문재, 여환명
Pacific Rim Summit on Industrial Biotechnology and Bioenergy
San Diego, California, USA
December 07, 2014 ~ December 09, 2014
pacific_rim_-정한섭,장수경(화학실).pdf (1.09MiB, 22Hits)
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10. EVA/Intumescent Agent Flame Retardant Composite Materials using Organic/Inorganic Hybrid Filler [Oral]
박지원
International Conference on Construction Materials and Structures (ICCMATS 2014)
University of Johannesburg, South Africa
November 24, 2014 ~ November 26, 2014
표지이미지 없음
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11. Laser Assisted EZR Debonding Technology for 3D-TSV Packaging Process [Oral]
이승우, 이태형, 박지원, 박초희, 김현중, 이성훈, 김승만, 이재학, 송준엽
Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference
University of Tokyo, Japan
October 22, 2014 ~ October 24, 2014
ADMETA_PLUS_2014.pdf (494.53KiB, 12Hits)
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12. Design and Characterizations of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process [Poster]
이승우, 이태형, 박지원, 박초희, 김현중, 이성훈, 김승만, 이재학, 송준엽
Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference
University of Tokyo, Japan
October 22, 2014 ~ October 24, 2014
ADMETA_PLUS_2014.pdf (494.53KiB, 17Hits)
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13. Polymer Testing of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process [Poster]
이승우, 이태형, 박지원, 박초희, 김현중, 이성훈, 김승만, 이재학, 송준엽
Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference
University of Tokyo, Japan
October 22, 2014 ~ October 24, 2014
ADMETA_PLUS_2014.pdf (494.53KiB, 16Hits)
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14. Polymer Synthesis and Properties of Temporary Bonding & Debonding Adhesives for 3D Multichip Packaging Process [Poster]
이승우, 이태형, 박지원, 박초희, 김현중, 이성훈, 김승만, 이재학, 송준엽
Advanced Metallization Conference 2014 : 24th Asian Session IWAPS Joint Conference
University of Tokyo, Japan
October 22, 2014 ~ October 24, 2014
ADMETA_PLUS_2014.pdf (494.53KiB, 13Hits)
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15. Superheated Steam Heat Treatment for Pitch Pine (Pinus Rigida) Lumber [Oral]
박용건
UFRO World Congress 2014
Salt Lake City, USA
October 05, 2014 ~ October 11, 2014
IUFRO.pdf (623.03KiB, 12Hits)
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