연구성과
1차년도
(2013.3 ~ 2014.2)
2차년도
(2014.3 ~ 2015.2)
3차년도
(2015.3 ~ 2016.2)
4차년도
(2016.3 ~ 2017.2)
5차년도
(2017.3 ~ 2018.2)
6차년도
(2018.3 ~ 2019.2)
7차년도
(2019.3 ~ 2020.2)
논문 (Paper) 더보기
01. Synthesis and properties of flexible polyester with urethane polyol for automotive pre-coated metals
Yong-Hee Lee, Hyun-Joong Kim†, Sung-Ju Lee, Ji-Won Park
Journal of Adhesion Science and Technology, 30(14), pp 1537-1554, 2016
02. The Effect of Laser Irradiation on Peel Strength of Temporary Adhesives for wafer Bonding
Seung-Woo Lee, Hyun-Joong Kim†, Tae-Hyung Lee, Ji-Won Park, Cho-Hee Park, Seung-Man Kim, Sung-Hun Lee, Jun-Yeob Song, Jae-Hak Lee
International Journal of Adhesion & Adhesives, 57, pp 9-12, 2015
The_effect_of_laser_irradiation_on_peel_strength_of_temporary_adhesives_for_wafer_bonding.PDF (748.81KiB, 36Hits)
03. The Effect of Laser Irradiation on Peel Strength of Temporary Adhesives for wafer Bonding
Seung-Woo Lee, Hyun-Joong Kim†, Tae-Hyung Lee, Ji-Won Park, Cho-Hee Park, Seung-Man Kim, Sung-Hun Lee, Jun-Yeob song, Jae-Hak Lee
International Journal of Adhesion and Adhesives, 57, pp 9-12, 2015
2015-29 The_effect_of_laser_irradiation_on_peel_strength_of_temporary_adhesives_for_wafer_bonding.PDF (727.02KiB, 17Hits)
04. Synthesis and UV-Curing Behaviors of Urethane Acrylic Oligomers Modified by the Incorporation of Silicone Diols into the Soft Segments for a 3D Multi-Chip Package Process
Seung-Woo Lee, Hyun-Joong Kim†, Tae-Hyung Lee, Ji-Won Park
Journal of Electronic Materials, 44,7, pp 2406-2413, 2015
2015-37 Synthesis and UV-Curing Behaviors of Urethane Acrylic Oligomers Modified by the Incorporation of Silicone Diols into the Soft Segments for a 3D Multi-Chip Package Process.pdf (1014.79KiB, 9Hits)
05. Physical Structure Behavior to Wettability ofEelectrospun Poly(Lactic Acid)/Polysaccharide Composite Nanofibers
Jackapon Sunthornvarabhas, Jackapon Sunthornvarabhas†, Pathama Chatakanonda, Kuakoon Piyachomkwan, G.G Chase, Hyun-Joong Kim, Klanarong Sriroth
Advanced Composite Materials, 22, 6, pp 401~409, 2014
Physical_structure_behavior_to_wettability_of_electrospun_poly(lactic_acid)_polysaccharide_composite_nanofibers.pdf (415.83KiB, 26Hits)
학술발표 (Conference) 더보기
01. Variation of adhesion properties with molecular weight of cured and non-cured acrylic PSAs [Oral]
이정훈, 이태형, 심규성
39th The Adhesion Society 2016
Texas,USA
February 21, 2016 ~ February 24, 2016
The Adhesion Society 2016.pdf (36.52KiB, 23Hits)
목록자료 없음
초록1페이지 없음
02. Curing behavior and adhesion performance of acrylic PSAs with different curing agent contents [Poster]
이정훈, 이태형, 심규성
39th The Adhesion Society 2016
Texas, USA
February 21, 2016 ~ February 24, 2016
The Adhesion Society 2016.pdf (36.52KiB, 14Hits)
목록자료 없음
초록1페이지 없음
03. Fabrication and Characterization of Flame-retardant EVA/Nano-Clay Composites [Oral]
김훈
International Conference on Mechanics
Guilin, China
August 15, 2015 ~ August 16, 2015
표지이미지 없음
목록자료 없음
초록1페이지 없음
04. Composite Development of PLA/CCS based Polymer [Oral]
이성주, 심규성
The 5th International Conference on Bio-based Polymers
Engineering Auditorium NUS, Singapore
June 24, 2015 ~ June 27, 2015
The 5th International Conference on Bio-based Polymers.pdf (1.13MiB, 13Hits)
목록자료 없음
초록1페이지 없음
05. Improved Strength of the PLA utilizing Nano-Cellulose [Oral]
이태훈, 김훈
The 5th International Conference on Bio-based Polymers
Engineering Auditorium NUS, Singapore
June 24, 2015 ~ June 27, 2015
The 5th International Conference on Bio-based Polymers.pdf (1.13MiB, 10Hits)
목록자료 없음
초록1페이지 없음
연구교류 (Research) 더보기
01. Research Trend of Nano-Composie & Bio-Composites
강연자 : 김현중
소속 : 서울대학교 농업생명과학대학 산림과학부 환경재료과학전공 교수
강연일시 : September 12, 2014
Research Trend of Nano-Composite & Bio-Composites.JPG (218.38KiB, 48Hits)
02. The Role of The Adhesive to The Bottleneck in The Electonic Convergence Industry
강연자 : 김현중
소속 : 서울대학교 농업생명과학대학 산림과학부 환경재료과학전공
강연일시 : September 08, 2014
The role of the Adhesive to Overcome the Bottleneck.JPG (179.37KiB, 36Hits)
산학교류 (Cooperation) 더보기
01. [기술지도자문] 고기능성 접착소재 기초역량강화
협력기업 : H&S하이텍(주)
연구비 : 60,000천원
연구기간 : 2016-01-01~2016-12-31

02. 고기능성 점,접착소재의 요소기술 분석 및 설계
협력기업 : ENF테크놀로지(주)
연구비 : 140,000천원
연구기간 : 2015-08-01~2017-07-31